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AN1115 SEF104B Z5225 50K0J BD954 025AT 926309 00V1C4
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 Si1031R/X
New Product
Vishay Siliconix
P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V) rDS(on) (W)
8 @ VGS = -4.5 V -20 12 @ VGS = -2.5 V 15 @ VGS = -1.8 V 20 @ VGS = -1.5 V
1.5-V Rated
ID (mA)
-150 -125 -100 -30
FEATURES
D D D D D D High-Side Switching Low On-Resistance: 8 W Low Threshold: 0.9 V (typ) Fast Switching Speed: 45 ns 1.8-V Operation Gate-Source ESD Protection
BENEFITS
D D D D D Ease in Driving Switches Low Offset (Error) Voltage Low-Voltage Operation High-Speed Circuits Low Battery Voltage Operation
SC-75A or SC-89
G 1
APPLICATIONS
D Drivers: Relays, Solenoids, Lamps, Hammers, Displays, Memories D Battery Operated Systems D Power Supply Converter Circuits D Load/Power Switching Cell Phones, Pagers
SC-75A (SOT - 416): Si1031R SC-89 (SOT - 490): SI1031X
3 D
S
2 Top View
Marking Code: H
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Si1031R Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a Pulsed Drain Currenta Continuous Source Current (diode conduction)a Maximum Power Dissipationa TA = 25_C TA = 85_C PD TJ, Tstg ESD TA = 25_C TA = 85_C IDM IS -250 280 145
SI1031X 5 secs
-20 "6 V -165 -150 -600 -155 -125 mA
Symbol
VDS VGS
5 secs
Steady State
Steady State
Unit
-150 ID -110 -500
-140 -100
-200 250 130
-340 340 170 -55 to 150 2000
-240 300 150 mW _C V
Operating Junction and Storage Temperature Range Gate-Source ESD Rating (HBM, Method 3015) Notes a. Surface Mounted on FR4 Board. Document Number: 71171 S-31507--Rev. B, 14-Jul-03
www.vishay.com
1
Si1031R/X
Vishay Siliconix
New Product
SPECIFICATIONS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage VGS(th) VDS = VGS, ID = -250 mA VDS = 0 V, VGS = "2.8 V Gate-Body Gate Body Leakage IGSS VDS = 0 V, VGS = "4.5 V VDS = -16 V, VGS = 0 V VDS = -16 V, VGS = 0 V, TJ = 85_C VDS = -5 V, VGS = -4.5 V VGS = -4.5 V, ID = -150 mA Drain-Source On State Drain Source On-State Resistancea rDS( ) DS(on) VGS = -2.5 V, ID = -125 m A VGS = -1.8 V, ID = -100 m A VGS = -1.5 V, ID = -30 m A Forward Transconductancea Voltagea gfs VSD VDS = -10 V, ID = -150 mA IS = -150 mA, VGS = 0 V 0.4 -1.2 -200 8 12 15 20 S V W -0.40 "0.5 "1 -1 -1.20 "1 "2 -500 -10 mA nA mA mA V
Symbol
Test Condition
Min
Typa
Max
Unit
Zero Gate Voltage Drain Current On-State Drain Currenta
IDSS ID(on)
Diode Forward
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Qg Qgs Qgd td(on) tr td(off) tf VDD = -10 V, RL = 65 W ID ^ -150 mA, VGEN = -4.5 V, RG = 10 W VDS = -10 V, VGS = -4.5 V, ID = -150 mA 1500 150 450 55 30 60 30 ns pC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (TA = 25_C UNLESS NOTED)
Output Characteristics
0.5 VGS = 5 thru 2.5 V 0.4 I D - Drain Current (A) 1.8 V 0.3 I D - Drain Current (mA) 2V 400 500 TJ = -55_C 25_C
Transfer Characteristics
300
125_C
0.2
200
0.1
100
0.0 0 1 2 3 4 5 6
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
VDS - Drain-to-Source Voltage (V) www.vishay.com
VGS - Gate-to-Source Voltage (V) Document Number: 71171 S-31507--Rev. B, 14-Jul-03
2
Si1031R/X
New Product
TYPICAL CHARACTERISTICS (TA = 25_C UNLESS NOTED)
On-Resistance vs. Drain Current
25 r DS(on) - On-Resistance ( W ) VGS = 1.8 V C - Capacitance (pF) 20 120 VGS = 0 V f = 1 MHz
Vishay Siliconix
Capacitance
100
80
Ciss
15 VGS = 2.5 V 10 VGS = 4.5 V 5
60
40 Coss 20 Crss 0
0 0 200 400 600 800 1000
0
4
8
12
16
20
ID - Drain Current (mA)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 10 V ID = 150 mA 4 1.6
On-Resistance vs. Junction Temperature
r DS(on) - On-Resistance ( W) (Normalized)
1.4 VGS = 4.5 V ID = 150 mA 1.2
3
2
1.0
VGS = 1.8 V ID = 125 mA
1
0.8
0 0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.6 -50
-25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Source-Drain Diode Forward Voltage
1000 IS - Source Current (mA) TJ = 125_C r DS(on) - On-Resistance ( W ) 40 50
On-Resistance vs. Gate-to-Source Voltage
100 TJ = 25_C TJ = -55_C 10
ID = 150 mA 30
20
10 ID = 125 mA
1 0.0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1 2 3 4 5 6 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Document Number: 71171 S-31507--Rev. B, 14-Jul-03
www.vishay.com
3
Si1031R/X
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (TA = 25_C UNLESS NOTED)
Threshold Voltage Variance vs. Temperature
0.3 3.0
IGSS vs. Temperature
0.2 V GS(th) Variance (V) ID = 0.25 mA 0.1 IGSS - (mA)
2.5
2.0 VGS = 2.8 V
-0.0
1.5
-0.1
1.0
-0.2
0.5
-0.3 -50
-25
0
25
50
75
100
125
0.0 -50
-25
0
25
50
75
100
125
TJ - Temperature (_C)
TJ - Temperature (_C)
BVGSS vs. Temperature
BVGSS - Gate-to-Source Breakdown Voltage (V) 0 -1 -2 -3 -4 -5 -6 -7 -50
-25
0
25
50
75
100
125
TJ - Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient (SC-75A, Si1031R Only)
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
0.2
Notes:
0.1 0.1 0.05
t1 PDM
0.02
t2 1. Duty Cycle, D =
2. Per Unit Base = RthJA =500_C/W
t1 t2
Single Pulse 0.01 10 - 4 10 - 3 10 - 2 10 - 1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
www.vishay.com
4
Document Number: 71171 S-31507--Rev. B, 14-Jul-03


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